?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: january 4, 2012 SP3012 series SP3012 low capacitance esd protection - SP3012 series description applications the SP3012 integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (esd). this robust device can safely absorb repetitive esd strikes above the maximum level speci?ed in the iec61000-4-2 international standard (8kv contact discharge) without performance degradation. the extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as hdmi, usb3.0, usb2.0, and ieee 1394. features t & 4 %
* & $
12kv contact, 25kv air t & ' 5
* & $
" (t p =5/50ns) t - j h i u o j o h
* & $
" u p =8/20s) t - p x d b q b d j u b o d f p g q ' (typ) per i/o t - p x m f b l b h f d v s s f o u p g ? " . " 9
b u 7 t 4 n b m m g p s n g b d u p s ? % ' / package saves board space t - $ % 1 % 1 5 7 t t & y u f s o b m 4 u p s b h f t t % 7 % # m v f 3 b z 1 m b z f s t t % f t l u p q t t . 1 1 . 1 t 4 f u 5 p q # p y f t t . p c j m f 1 i p o f t t / p u f c p p l t t % j h j u b m $ b n f s b t pinout 5 4 3 2 1 6 7 8 9 10 functional block diagram gnd (pins 3,8) pin 5 pin 2 pin 1 pin 4 gnd (pins 3,8) pin 5 pin 2 pin 1 pin 4 *pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. - j g f 4 v q q p s u / p u f not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. application example for usb3.0 SP3012 series 0.5pf rail clamp array rohs pb green signal gnd case gnd usb controller usb port sp3003 optional sstx+ sstx - ssrx+ ssrx - gnd d+ d - SP3012 ic nc *package is shown as transparent v bus
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: january 4, 2012 SP3012 series low capacitance esd protection - SP3012 series SP3012 caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not impli ed. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 4.0 " t op operating temperature -55 to 125 c t 4 5 0 3 storage temperature -60 to 150 c electrical characteristics (t op =25 o c) parameter symbol test conditions min typ max units 3 f w f s t f 4 u b o e p g g 7 p m u b h f v 3 8 . i 3 ? ? " 5.0 v 3 f w f s t f - f b l b h f $ v s s f o u i - & " , v 3 7
" o z * 0 u p ( / % 1. 5 ? " clamp voltage 1 v c i pp "
u p ? t
' x e 6.6 v i pp "
u p ? t
' x e 7. 0 v % z o b n j d 3 f t j t u b o d f 3 % : / (v c2 - v c1 ) / (i pp2 - i pp1 ) 0.4 & 4 % 8 j u i t u b o e 7 p m u b h f 1 v esd iec61000-4-2 (contact) 12 kv * & $ " j s
25 kv diode capacitance 1 c * 0 ( / % 3 f w f s t f # j b t 7
g . ) [ 0.5 q ' diode capacitance 1 c i/o-/o 3 f w f s t f # j b t 7
g . ) [ 0.3 q ' / p u f 1 parameter is guaranteed by design and/or device characterization. insertion loss (s21) i/o to gnd capacitance vs. bias voltage clamping voltage vs. i pp bias voltage (v) capacitance (pf) 0.0 0.2 0.4 0.0 1.0 2.0 3.0 4.0 5.0 0.6 0.8 1.0 0.0 2.0 4.0 6.0 8.0 10.0 1234 clamp voltage (v) current (a) -30 -18 -15 -12 -9 -3 0 attenuation (db) -6 -21 -24 -27 100 1000 frequency (mhz) pulse waveform 0% 10% 20% 30% 40% 5 0% 60% 70% 80% 90% 100% 110% 0.0 5 .0 10.0 1 5 .0 20.0 2 5 .0 30.0 time (s) percent of i pp
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: january 4, 2012 SP3012 series SP3012 low capacitance esd protection - SP3012 series tvs diode arrays (spa ? family of products) sp3010 time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition 1 c o ' s f f b t t f n c m z pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters product characteristics lead plating 1 s f 1 m b u f e ' s b n f lead material $ p q q f s " m m p z lead coplanarity 0.0004 inches (0.102mm) substitute material silicon body material molded epoxy flammability 6 - 7 / p u f t " m m e j n f o t j p o t b s f j o n j m m j n f u f s t 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. " m m t q f d j m d b u j p o t d p n q m z u p + & % & $ 4 1 & $ . 0 * t t v f " 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. part numbering system part marking system sp 3012 04 u t g series package dfn-10 (2. 5 x1.0mm) t= tape & reel g= green number of channels C silicon protection array (spa tm ) family of tvs diode arrays v h 4 product series v = SP3012 assembly site number o f channels part number package marking min. order qty. 4 1 6 5 ( ? % ' / vh4 3000 ordering information
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: january 4, 2012 SP3012 series low capacitance esd protection - SP3012 series SP3012 embossed carrier tape & reel speci?cation dfn-10 package dimensions dfn-10 (2.5x1.0x0.5mm) package dfn-10 (2.5x1.0x0.5mm) symbol millimeters a0 1.30 +/- 0.10 b0 2.83 +/- 0.10 d0 ? 1.50 + 0.10 d1 ? 1.00 + 0.25 e 1.75 +/- 0.10 f 3.50 +/- 0.05 k0 0.65 +/- 0.10 p0 4.00 +/- 0.10 p1 4.00 +/- 0.10 p2 2.00 +/- 0.05 t 0.254 +/- 0.02 w 8.00 + 0.30 /- 0.10 k0 a0 b0 p2 p1 p0 t f e w d0 d1 5 o max 5 o max user feeding direction pin 1 location dfn-10 (2.5x1.0x0.5mm) symbol millimeters inches min nom max min nom max a 0.48 0.515 0.55 0.019 0.020 0.021 a1 0.00 -- 0.05 0.000 0.022 a3 3 f g 3 f g b 0.15 0.20 0.25 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.018 d 2.40 2.50 2.60 0.094 0.098 0.102 e 0.90 1.00 1.10 0.035 0.039 0.043 e 0.50 bsc 0.020 bsc l 0.30 0.365 0.43 0.012 0.014 0.016 d e b top view a a bottom view 0.0 5 c b a1 b1 a3 c seating plane side view 0.10 c a m b 0.0 5 c m l e 2xr0.07 5 mm (7x) r0.12 5 0.0 5 c x1 x p p1 z (c) g y (y1) soldering pad layout recomended soldering pad layout dimensions inch millimeter c (0.034) (0.875) g 0.008 0.20 p 0.020 0.50 p1 0.039 1.00 x 0.008 0.20 x1 0.016 0.40 y 0.027 0.675 y1 (0.061) (1.55) z 0.061 1.55 x1 x p p1 z (c) g y (y1) soldering pad layout alternative
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